R&D Center Packaging Solutions

---

Senyou Packaging's 2,000 m² R&D Center is home to a 20-person interdisciplinary team of mechanical, software, and electrical engineers, boasting over 13 years of collective industry experience in developing innovative packaging solutions.

Core Technical Competencies:

Non-standard equipment design and automation integration for innovative packaging solutions

3D modeling and mechanical design expertise: Pro-E, SolidWorks, enhancing our R&D Center offerings

Industrial control programming: PLC, HMI, crucial for our advanced packaging solutions

Software development: VB, VC++, tailored for Senyou Packaging’s specific needs

Wet-press process engineering and mold design, integral to our packaging solutions

Precision measurement and quality metrology, ensuring top-tier outcomes in packaging technology.